Zhilun New Material raises 100M CNY Series B for electronic-grade epoxy resins

What's the deal? Zhilun New Material Technology (Xi'an) has raised more than 100,000,000 CNY (roughly $14.8 million) in a Series B round, the company announced in July 2026. It develops and produces ultra-high-purity, electronic-grade epoxy resins.

What does it make? Zhilun handles the research, production, and sale of high-performance modified epoxy resins. Its core products include bisphenol A, bisphenol F, and tetramethyl biphenyl epoxy resins.

Where it fits: The resins go into semiconductor packaging materials such as epoxy moulding compounds, copper-clad laminates, and electronic adhesives. They also serve composites like wind turbine blades and high-end coatings.

Why now? The company is a council member of an electronic chemicals new-materials industry alliance, positioning it in a supply chain where high-purity domestic materials are in demand. This Series B follows quickly on earlier funding, a sign of investor appetite for the segment.

The signal: Ultra-high-purity materials sit at the heart of semiconductor packaging, and a fast re-raise points to sustained backing for Chinese suppliers building out that domestic capability.

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