Chip packaging firm Jiusi Electronic lands Series A+ from Xinhe Capital

What's the deal? Hefei Jiusi Electronic TechnologyDealroom has a profile for this one. Try Dealroom → has raised a Series A+ round, backed by Xinhe CapitalDealroom has a profile for this one. Try Dealroom →. The deal was announced in July 2026.

What's the endgame? Jiusi specialises in thin-film metallisation and high-precision patterning on ceramic and other substrates, including single- and multi-layer aluminium nitride, alumina ceramic, silicon carbide, diamond, and quartz glass. It aims to supply high-performance, high-reliability, and cost-effective packaging solutions.

The signal: Backing for a specialist substrate and packaging player points to continued investor appetite for the materials and processes underpinning advanced chip packaging.

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