Jingxin Microelectronics Technology

The company's business model is centered on providing high-speed data switching chips to a diverse client base that includes government, military, finance, energy, transportation, electric power, and telecommunications sectors. Its product portfolio is engineered for applications in 5G infrastructure, artificial intelligence, big data centers, and the industrial internet. Key products include switching, bridge, protocol packet conversion, security, and smart network card chips that support various protocols like Ethernet and RapidIO. Specific chip models mentioned are the NRS1800, SDI3210, ESW5610, and the PRB0400 PCIe to SRIO board.

Since its inception, Jingxin Microelectronics has progressed through several funding stages, indicating investor confidence in its market position and technology. The company completed an accelerator/incubator round in May 2020 and has since secured multiple rounds of venture capital. A Series A financing in January 2023 raised over CNY 100.0M (~$14.7M) from investors including Shenzhen Venture Capital, Landstone Capital, and Poly Capital. By May 2024, the company had reached a Series B stage, securing an additional $13.9M to fuel further research, development, and mass production efforts. Other notable investors include SDIC Unity Capital, Aurora Private Equity, Guoding Capital, and Jiuyou Capital.