Tianjin Xunlin Technology

Advanced manufacturing company focused on surface metallization of ceramic and glass electronic substrates, using proprietary PVD (physical vapor deposition) processes to enable copper coating routes for next-generation packaging and module applications. Its offerings are positioned as an alternative pathway to conventional copper-clad or plated substrate approaches, targeting bottlenecks in performance and cost for use cases such as semiconductor advanced processes, high-definition display modules, and power devices (including demanding thermal and reliability environments). The company’s product scope, as presented publicly, includes copper-coated glass substrates and ceramic substrate solutions associated with common industry process families (e.g., DPC, DBC/AMB). Public materials also indicate manufacturing presence in Tianjin and Qingdao and progression from process validation toward production and early batch orders. In 2025, the company reported completing a pre–Series A financing round to support R&D, commercialization, and industrial capacity build-out, and Chinese corporate registry data lists the entity as operating. Keywords: PVD, metallization, copper coating, glass substrate, ceramic substrate, DPC, DBC, AMB, semiconductor packaging, display modules, power electronics