Beijing Qinghe Jingyuan Semiconductor Technology

Beijing Qinghe Jingyuan Semiconductor Technology (Group) Co., Ltd., which also operates under the name iSABers Group, is a high-tech enterprise within China's semiconductor sector, established on July 8, 2020. The firm has positioned itself as a key player in bonding integration technology, a critical area for advanced semiconductor manufacturing. Its core operations encompass the research, development, and manufacturing of high-end bonding equipment alongside providing precision bonding process foundry services.

The company's business model is structured around a dual-pronged approach of "equipment manufacturing + process services," aiming to deliver comprehensive solutions across the semiconductor industry chain. This strategy caters to clients involved in advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration, and MEMS sensors. Revenue is generated through the sale of its specialized equipment and fees from its foundry services. The company's product portfolio includes an ultra-high vacuum room temperature bonding system, hybrid bonding equipment, and hot pressing bonding equipment, all developed with its own intellectual property.

A significant achievement for the company was the launch of the SAB8210CWW, the world's first C2W & W2W dual-mode hybrid bonding equipment. This system is designed to be versatile, supporting multiple wafer sizes and advanced chip processing capabilities, which helps clients reduce capital expenditure and shorten their research-to-production cycles. It has applications in the production of Micro-LEDs, various memory types like NAND, DRAM, and HBM, as well as stacked integrated circuits (SICs) and systems-on-chips (SoCs). Since its founding, the company has secured significant funding, including a Series A round and a substantial funding round of over CNY 300 million in 2024, with investors such as Shenzhen Capital Group, Tianjin Venture Capital, and Wuxi Chipown Micro-electronics.

Keywords: semiconductor bonding, advanced packaging, wafer bonding equipment, hybrid bonding, MEMS sensors, heterogeneous integration, precision bonding, foundry services, chip-to-wafer, wafer-to-wafer, C2W, W2W, high-end equipment manufacturing, semiconductor solutions, integrated circuit packaging, Micro-LED manufacturing, DRAM packaging, NAND packaging, HBM, stacked integrated circuits