ACM Research

Founded in Silicon Valley in 1998 by Dr. David H. Wang, the company initially targeted stress-free copper polishing technology. Dr. Wang, who holds a Ph.D. in Precision Engineering from Osaka University and a B.S. from Tsinghua University, leveraged his extensive R&D background to invent this technology and has since secured over 100 patents. In 2003, responding to increasing defect-reduction challenges in IC production, ACM pivoted to develop single-wafer cleaning equipment. A significant milestone was the establishment of ACM Research (Shanghai), Inc. in 2006, which now houses its main R&D and manufacturing operations. The company went public on the NASDAQ in November 2017. In December 2024, the company was added to the U.S. Department of Commerce's Entity List.

ACM Research's core offering lies in its proprietary cleaning technologies: Space Alternated Phase Shift (SAPS™) and Timely Energized Bubble Oscillation (TEBO™). SAPS technology delivers uniform megasonic energy across the entire wafer, effectively removing microscopic defects even on warped wafers. TEBO is designed for damage-free cleaning of fragile, high-aspect-ratio 3D patterned wafers, such as FinFET and 3D NAND, which is crucial for next-generation semiconductor devices. The product portfolio includes a range of equipment for front-end-of-line (FEOL) and back-end-of-line (BEOL) processes, such as single-wafer cleaners, furnaces, and electro-chemical plating (ECP) systems. These systems are designed to improve manufacturing yields, reduce chemical consumption, and lower the overall cost of ownership for chipmakers.